Display device

ABSTRACT

A display device includes: multiple layers including a display element layer, the multiple layers including a sealing layer for covering the display element layer; and a polarization plate attached to a first layer and a second layer of the multiple layers with an adhesive layer. The multiple layers includes inorganic films and organic films. All of the inorganic films are disposed to avoid an edge area that is at least a part of a peripheral portion of the resin substrate. The polarization plate has an edge above the edge area of the resin substrate. The first layer is disposed to avoid the edge area of the resin substrate. The first layer at an edge has an upper surface sloping downward toward the edge area. The second layer has a portion in the edge area of the resin substrate and between the resin substrate and the adhesive layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of InternationalApplication PCT/JP2018/042812 filed on Nov. 20, 2018, which claimspriority from Japanese patent application JP2018-033010 filed on Feb.27, 2018. The contents of these applications are incorporated herein byreference in their entirety.

BACKGROUND 1. Field

This relates to a display device.

2. Description of the Related Art

A bendable display panel has been developed (JP 2017-211420A). Such adisplay panel uses a resin substrate, and an inorganic film is laminatedon the resin substrate for barrier to impurities. An organicelectroluminescence display device, due to vulnerability to moisture,has display elements covered with a sealing film (JP 2013-105144A). Toimprove moisture barrier properties, a sealing film, with a structure inwhich an organic film is interposed above and below a pair of inorganicfilms, is known. The pair of inorganic films are in contact with eachother at a periphery of the sealing film. A polarization plate isattached to the sealing film for preventing external light reflection(JP 2017-152252A).

Cracking in the inorganic film may leads to moisture intrusion at theperiphery of the display panel. Thus, the inorganic film should beremoved at the periphery of the display panel. Removing the inorganicfilm leaves unevenness on the periphery. After attaching a polarizationplate larger in size than the display panel, for example, and finallycutting it by a laser, bubbles are generated under the polarizationplate, accelerating separation of the polarization plate.

SUMMARY

This aims at preventing separation of a polarization plate.

A display device includes: a resin substrate; multiple layers laminatedon the resin substrate, the multiple layers including a display elementlayer for displaying images, the multiple layers including a sealinglayer for covering the display element layer; and a polarization plateattached to a first layer and a second layer of the multiple layers withan adhesive layer. The multiple layers include some inorganic films andsome organic films. All of the inorganic films are disposed to avoid anedge area that is at least a part of a peripheral portion of the resinsubstrate. The polarization plate has an edge above the edge area of theresin substrate. The first layer is disposed to avoid the edge area ofthe resin substrate. The first layer at an edge has an upper surfacesloping downward toward the edge area. The second layer has a portion inthe edge area of the resin substrate and between the resin substrate andthe adhesive layer.

Thus, all of the inorganic films avoid the edge area of the resinsubstrate. The second layer intervenes between the resin substrate andthe adhesive layer and in the edge area, leading to small unevenness,preventing separation of the polarization plate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a display device in a first embodiment.

FIG. 2 is a II-II line cross-sectional view of the display device inFIG. 1.

FIG. 3 is a circuit diagram of the display device in FIG. 1.

FIG. 4 is a IV-IV line cross-sectional view of the display device inFIG. 1.

FIG. 5 is a V-V line cross-sectional view of the display device in FIG.1.

FIG. 6 is a VI-VI line cross-sectional view of the display device inFIG. 1.

FIG. 7 is an explanatory diagram of a manufacturing method of thedisplay device in the first embodiment.

FIG. 8 is a plan view of a display device in a second embodiment.

FIG. 9 is a IX-IX line cross-sectional view of the display device inFIG. 8.

FIG. 10 is a X-X line cross-sectional view of the display device in FIG.8.

FIG. 11 is a XI-XI line cross-sectional view of the display device inFIG. 8.

FIG. 12 is a cross-sectional view of a display device in a thirdembodiment.

FIG. 13 is a plan view of a display device in a fourth embodiment.

FIG. 14 is a XIV-XIV line cross-sectional view of the display device inFIG. 13.

FIG. 15 is a XV-XV line cross-sectional view of the display device inFIG. 13.

FIG. 16 is a XVI-XVI line cross-sectional view of the display device inFIG. 13.

FIG. 17 is a XVII-XVII line cross-sectional view of the display devicein FIG. 13.

FIG. 18 is a schematic view of usage of the display device.

FIG. 19 is a XIX-XIX line schematic cross sectional view of the displaydevice in FIG. 18.

DETAILED DESCRIPTION

Hereinafter, some embodiments will be described with reference to thedrawings. Here, the invention can be embodied according to variousaspects within the scope of the invention without departing from thegist of the invention and is not construed as being limited to thecontent described in the embodiments exemplified below.

The drawings are further schematically illustrated in widths, thickness,shapes, and the like of units than actual forms to further clarifydescription in some cases but are merely examples and do not limitinterpretation of the invention. In the present specification and thedrawings, the same reference numerals are given to elements having thesame functions described in the previously described drawings and therepeated description will be omitted.

Further, in the detailed description, “on” or “under” in definition ofpositional relations of certain constituents and other constituentsincludes not only a case in which a constituent is located just on orjust under a certain constituent but also a case in which anotherconstituent is interposed between constituents unless otherwisementioned.

First Embodiment

FIG. 1 is a plan view of a display device in a first embodiment. Thedisplay device is actually folded to be used. FIG. 1 is a developed viewof the display device before it is folded. FIG. 18 is a schematic viewof usage of the display device. FIG. 19 is a XIX-XIX line schematiccross sectional view of the display device in FIG. 18. The displaydevice includes a display 100. There is a spacer 102 inside curvature,preventing the display 100 from being bent too much. The display 100 hasflexibility and is folded outside a display area DA. A first flexibleprinted circuit board FP1 is connected to the display 100 outside thedisplay area DA. An integrated circuit chip CP is mounted on the firstflexible printed circuit board FP1 for driving image displayingelements. A second flexible printed circuit board FP2 is connected tothe first flexible printed circuit board FP1.

The display device may be an organic electroluminescence display device.The display device has the display area DA for displaying images. Thedisplay area DA displays a full-color image by forming full-colorpixels, each of which consist of unit pixels (subpixels) in some colorssuch as red, green, and blue.

FIG. 2 is a II-II line cross-sectional view of the display device inFIG. 1. A resin substrate 10 is formed from polyimide. Or, other resinmaterials can be used as long as the materials have satisfactoryflexibility for a sheet display or a flexible display. A reinforcementfilm 14 is attached to a back of the resin substrate 10 with a pressuresensitive adhesive 12.

A barrier inorganic film 16 (undercoat layer) is laminated on the resinsubstrate 10. The barrier inorganic film 16 has a three-layer laminatedstructure of a silicon oxide film 16 a, a silicon nitride film 16 b, anda silicon oxide film 16 c. The silicon oxide film 16 a of the lowestlayer is for improving close-fitting properties with the resin substrate10; the silicon nitride film 16 b of the middle layer is a blocking filmfrom external moisture and impurities; the silicon oxide film 16 c ofthe uppermost layer is for another blocking film to prevent hydrogenatoms in the silicon nitride film 16 b from diffusing on a side of asemiconductor layer 18 of a thin film transistor TR, but such astructure is not essential and an additional laminate, a single layer,or a two-layer laminate is applicable thereto.

An additional film 20 may be formed in an area where the thin filmtransistor TR is formed. The additional film may suppress characteristicchange of the thin film transistor TR due to light intrusion from achannel back or may provide the thin film transistor TR with abackgating effect by being formed from conductive material to apply acertain potential. In the embodiment, after the silicon oxide film 16 ais formed, the additional film 20 is formed in an island shapecorresponding to the area where the thin film transistor TR is formed,and then the silicon nitride film 16 b and the silicon oxide film 16 care laminated, whereby the additional film 20 is sealed in the barrierinorganic film 16; alternatively, the additional film 20 may be formedon the resin substrate 10, prior to forming the barrier inorganic film16.

The thin film transistor TR is on the barrier inorganic film 16. Apolysilicon thin film transistor is an example and only an N-chtransistor is herein illustrated, but a P-ch transistor may besimultaneously formed. The semiconductor layer 18 of the thin filmtransistor TR has a structure where a low concentration impurities areais provided between a channel area and a source/drain area. A siliconoxide film is herein used for a gate insulating film 22. A gateelectrode 24 is a part of a first wiring layer W1 made from MoW. Thefirst wiring layer W1 includes a first storage capacitor line CL1 inaddition to the gate electrode 24. A part of a storage capacitor Cs isformed between the first storage capacitor line CL1 and thesemiconductor layer 18 (source/drain area) with the gate insulating film22 interposed therebetween.

There is an interlayer dielectric 26 (silicon oxide film, siliconnitride film) laminated on the gate electrode 24. A second wiring layerW2, which includes portions for a source/drain electrode 28, is on theinterlayer dielectric 26. A three layers laminate structure of Ti, Al,and Ti is herein employed. The first storage capacitor line CL1 (part ofthe first wiring layer W1) and a second storage capacitor line CL2 (partof the second wiring layer W2) constitute another portion of the storagecapacitor Cs, with the interlayer dielectric 26 interposed therebetween.

A flattening organic film 32 covers the source/drain electrode 28. Resinsuch photosensitive acrylic is used for the flattening organic film 32because of superior surface flatness, compared with inorganic insulationmaterial formed by chemical vapor deposition (CVD). Laminated inorganicfilms between the resin substrate 10 and the flattening organic film 32constitute a circuit layer 34. The circuit layer 34 is connected to adisplay element layer 30 for displaying images.

The flattening organic film 32 is removed at a pixel contact portion 36and has an indium tin oxide (ITO) film 38 formed thereon. The indium tinoxide film 38 includes a first transparent conductive film 38 a and asecond transparent conductive film 38 b, which are separated from eachother.

By removing the flattening organic film 32, the second wiring layer W2has a surface exposed and is covered with the first transparentconductive film 38 a. A silicon nitride film 40 is on the flatteningorganic film 32, covering the first transparent conductive film 38 a.The silicon nitride film 40 has an opening at the pixel contact portion36, whereby a pixel electrode 42 is laminated on and connected to thesource/drain electrode 28 through the opening. The pixel electrode 42 isa reflective electrode and has a three-layer laminate structure of anindium zinc oxide film, an Ag film, and an indium zinc oxide film. Theindium zinc oxide film may be herein replaced by an indium tin oxidefilm. The pixel electrode 42 extends laterally from the pixel contactportion 36 and to above the thin film transistor TR.

The second transparent conductive film 38 b is adjacent to the pixelcontact portion 36 and under the pixel electrode 42 (further below thesilicon nitride film 40). The second transparent conductive film 38 b,the silicon nitride film 40, and the pixel electrode 42 overlap with oneanother, thereby forming an additional capacitance Cad.

An insulation organic film 44, which is called a bank (rib) for apartition of adjacent pixel areas, is on the flattening organic film 32and over the pixel contact portion 36, for example. Photosensitiveacrylic may be used for the insulation organic film 44 just like theflattening organic film 32. The insulation organic film 44 has anopening for exposing a surface of the pixel electrode 42 as alight-emitting region, and the opening should have an edge in a gentletapered shape. A steep shape of the opening may cause insufficientcoverage of an organic electroluminescence layer 46 formed thereon.

The flattening organic film 32 and the insulation organic film 44 are incontact with each other through an opening in the silicon nitride film40 between them. This makes it possible to remove moisture and gasdesorbed from the flattening organic film 32 through the insulationorganic film 44 during heat treatment after the insulation organic film44 is formed.

The organic electroluminescence layer 46, made from organic materials,is laminate on the pixel electrode 42. The organic electroluminescencelayer 46 may be a single layer or may be a structure where a holetransport layer, a light-emitting layer, and an electron transport layerare laminated in this order from the pixel electrode 42. These layersmay be formed by vapor deposition or by application after solventdispersion, may be selectively formed for the respective pixelelectrodes 42 (respective sub-pixels), or may be formed all over thesurface covering the display area DA. The overall formation results in astructure for emitting white light, from which desired color wavelengthportion is extracted at every sub-pixel through a color filter (notshown).

There is a counter electrode 48 on the organic electroluminescence layer46. Due to a top emission structure employed herein, the counterelectrode 48 is transparent. A Mg layer and an Ag layer may be formed tobe as thin a film as outgoing light from the organic electroluminescencelayer 46 can pass. In comply with the forming order of the organicelectroluminescence layer 46, the pixel electrode 42 is an anode, andthe counter electrode 48 is a cathode. The plurality of pixel electrodes42, the counter electrode 48, and the organic electroluminescence layer46 between central portions of the respective pixel electrodes 42 andthe counter electrode 48 constitute the display element layer 30.

There is a sealing layer 50 on the counter electrode 48. The sealinglayer 50 may serve to prevent external moisture intrusion into theorganic electroluminescence layer 46 formed thereunder, requiring highgas barrier properties. The sealing layer 50 has a laminated structurewhere an encapsulation organic film 50 b intervenes between a pair ofencapsulation inorganic films 50 a, 50 c (such as silicon nitride films)over and under it. The pair of encapsulation inorganic films 50 a, 50 coverlap with and in contact with each other around the encapsulationorganic film 50 b (FIG. 4). There may be a silicon oxide film or anamorphous silicon layer between each encapsulation inorganic film 50 a,50 c and the encapsulation organic film 50 b for improving close-fittingproperties. A reinforcement organic film 52 is laminated on the sealinglayer 50. A polarization plate 56 is attached to the reinforcementorganic film 52 with an adhesive layer 54. The polarization plate 56 maybe a circular polarization plate.

FIG. 3 is a circuit diagram of the display device in FIG. 1. The circuitincludes a plurality of scan lines GL connected to a scanning circuit GDand a plurality of signal lines DL connected to a signal drive circuitSD. The integrated circuit chip CP in FIG. 1 stores the signal drivecircuit SD. An area surrounded by adjacent two scan lines GL andadjacent two signal lines DL is one pixel PX. The pixel PX includes thethin film transistor TR for a drive transistor and the thin filmtransistor TR2 for a switch, the storage capacitor Cs, and theadditional capacitance Cad. By applying gate voltage to the scan lineGL, the thin film transistor TR2 is turned ON, a video signal issupplied from the signal line DL, and the storage capacitor Cs and theadditional capacitance Cad stores charge. By storing the charge in thestorage capacitor Cs, the thin film transistor TR is turned ON, and acurrent flows from a power line PWL to a light-emitting element OD. Withthe current, the light-emitting element OD emits light.

FIG. 4 is a IV-IV line cross-sectional view of the display device inFIG. 1. There are multiple layers laminated on the resin substrate 10.Each of the multiple layers is an organic film or an inorganic film. Thedisplay element layer 30 (FIG. 2) for displaying the images is includedin the multiple layers, the sealing layer 50 is also included in themultiple layers, and each of the encapsulation organic film 50 b and theencapsulation inorganic films 50 a, 50 c is one of the multiple layers.

Every inorganic film included in the multiple layers is situated toavoid an edge area EA, which is at least a part of a peripheral portionof the resin substrate 10 (outside the display area DA in FIG. 1), ormay avoid the whole peripheral portion. In FIG. 4, the barrier inorganicfilm 16 is integrally included in the circuit layer 34. The circuitlayer 34 in FIG. 4 has an edge 34E adjacent to the edge area EA.

The multiple layers include a first layer L1. The reinforcement organicfilm 52 is the first layer L1. The first layer L1 (reinforcement organicfilm 52) is situated to avoid the edge area EA of the resin substrate 10but entirely covers the display area DA in FIG. 1. The first layer L1 atan edge has an upper surface sloping downward toward the edge area EAoutside the display area DA in FIG. 4. The first layer L1 and the pairof encapsulation inorganic films 50 a, 50 c are aligned at tips. This isbecause the first layer L1 (reinforcement organic film 52) is used foran etching mask of the pair of encapsulation inorganic films 50 a, 50 c,and then is left without being removed. The insulation organic film 44is also formed to avoid the edge area EA.

The multiple layers include a second layer L2. The flattening organicfilm 32 is the second layer L2. The second layer L2 (the flatteningorganic film 32) in FIG. 2 is laminated on the circuit layer 34 anddiscontinuously extends to the edge area EA. The second layer L2 maycover the whole peripheral portion of the resin substrate 10. The secondlayer L2 and the edge area EA of the resin substrate 10 are aligned atouter edges. The second layer L2 overlaps with the edge of the circuitlayer 34. The second layer L2 overlaps with edges of the pair ofencapsulation inorganic films 50 a, 50 c. Depending on the formationorder, the edges of the pair of encapsulation inorganic films 50 a, 50 care on an edge of the second layer L2. The first layer L1 has an edge onthe edges of the pair of encapsulation inorganic films 50 a, 50 c. Thatis, the second layer L2 overlaps with the edge of the first layer L1. Inthe edge area EA of the resin substrate 10, a part of the second layerL2 intervenes between the resin substrate 10 and the adhesive layer 54.

The polarization plate 56 is attached to the first layer L1 and thesecond layer L2 with the adhesive layer 54. The polarization plate 56has an edge above the edge area EA of the resin substrate 10. Thepolarization plate 56 at outer edge is aligned with the edge area EA ofthe resin substrate 10.

In the embodiment, all of the inorganic films avoid the edge area EA ofthe resin substrate 10. In the edge area EA, the second layer L2intervenes between the resin substrate 10 and the adhesive layer 54,reducing unevenness and preventing separation of the polarization plate56.

FIG. 5 is a V-V line cross-sectional view of the display device inFIG. 1. FIG. 6 is a VI-VI line cross-sectional view of the displaydevice in FIG. 1. The resin substrate 10 has a bending area BA for usein curvature. For the curvature, the bending area BA has no inorganicfilm. The circuit layer 34 also avoids the bending area BA. The pressuresensitive adhesive 12 and the reinforcement film 14 also avoid thebending area BA. In the bending area BA, without the insulation organicfilm 44, there is the flattening organic film 32 (the second layer L2).The flattening organic film 32 in the bending area BA is in contact withand laminated on the resin substrate 10. In FIG. 5, the insulationorganic film 44 is situated next to the tip of the first layer L1, forstopping flow of materials at the insulation organic film 44 duringforming the first layer L1.

In the bending area BA, neither the adhesive layer 54 nor thepolarization plate 56 is provided, instead, a soft resin 58 is provided.The soft resin 58 has higher flexibility than other organic films, forpreventing the resin substrate 10 from being bent in too large curvature(in a too small curvature radius). The soft resin 58 is in contact withand laminated on the flattening organic film 32. The soft resin 58 issituated to extend beyond the bending area BA and on a part of the firstflexible printed circuit board FP1 (shown by a broken line in FIG. 1).The soft resin 58 in FIG. 6 extends to the peripheral portion of theresin substrate 10.

FIG. 7 is an explanatory diagram of a manufacturing method of thedisplay device in the first embodiment. In manufacturing processes, theresin substrate 10 and the polarization plate 56 are cut out from aresin substrate material 10A and a polarizing plate material 56A, whichare larger than the resin substrate 10 and the polarization plate 56. Bybeing cut out from such a large material, the resin substrate 10 and thepolarization plate 56 are aligned at edge surfaces, improving positionaccuracy of the polarization plate 56 and the display area DA.

Specifically, layers up to the first layer L1 in FIG. 2 (including thefirst layer L1) are laminated on the resin substrate material 10A. Forexample, inorganic materials are formed and patterned on the resinsubstrate material 10A, and the circuit layer 34 is formed to includethe barrier inorganic film 16. The flattening organic film 32 is formedon it. The pixel electrode 42, the insulation organic film 44, theorganic electroluminescence layer 46, and the counter electrode 48 arelaminated on it.

Additionally, the sealing layer 50 is formed. In FIG. 4, to stop flow oforganic material for forming the encapsulation organic film 50 b, a damis formed from a part of the insulation organic film 44. Forming thepair of encapsulation inorganic films 50 a, 50 c includes an etchingprocess in which the first layer L1 formed thereon is used as an etchingmask. As shown in FIG. 5, the dam, for forming the first layer L1 tostop the flow of the organic material, may be formed from a part of theinsulation organic film 44.

Then, the polarizing plate material 56A in FIG. 7 is attached to thefirst layer L1 and the second layer L2, with the adhesive layer 54. InFIG. 4, with the second layer L2 outside the circuit layer 34,unevenness between them is made smaller. In other words, in spite of theunevenness between the resin substrate 10 and the circuit layer 34 andnext to the edge 34E of the circuit layer 34, the unevenness is eased bythe second layer L2. Bubbles under the adhesive layer 54 are less likelyto be formed. Then, the laminate including the resin substrate material10A and the polarizing plate material 56A is cut along a cutline L inFIG. 7. A laser may be used for cutting.

Second Embodiment

FIG. 8 is a plan view of a display device in a second embodiment. FIG. 9is a IX-IX line cross-sectional view of the display device in FIG. 8.FIG. 8 is a developed view before the display device is folded.

In the embodiment, an insulation organic film 244 is the second layerL2. The insulation organic film 244 has a portion at the edge area EAand between a resin substrate 210 and an adhesive layer 254, and has apolarization plate 256 attached thereto with the adhesive layer 254.There is a flattening organic film 232 under the insulation organic film244 at the edge area EA. The flattening organic film 232 is alsolaminated on the circuit layer 34 (FIG. 2) and discontinuously extendsto the edge area EA.

The second layer L2 (the insulation organic film 244) does not overlapwith edges of a pair of encapsulation inorganic films 250 a, 250 c, butthe flattening organic film 232 overlaps with the edges of the pair ofencapsulation inorganic films 250 a, 250 c. There is a crevice betweenthe pair of encapsulation inorganic films 250 a, 250 c and the secondlayer L2. The flattening organic film 232 is in contact with theadhesive layer 254 in the crevice.

FIG. 10 is a X-X line cross-sectional view of the display device in FIG.8. FIG. 11 is a XI-XI line cross-sectional view of the display device inFIG. 8. In the bending area BA, in addition to the flattening organicfilm 232, the insulation organic film 244 (the second layer L2) is alsoprovided. A soft resin 258 is in contact with and laminated on theinsulation organic film 244. What is explained in the first embodimentis applicable to other matters in this embodiment. There is unevennessnext to the edge 34E of the circuit layer 34 and between the resinsubstrate 210 and the circuit layer 34, but the unevenness is eased bythe second layer L2.

Third Embodiment

FIG. 12 is a cross-sectional view of a display device in a thirdembodiment. This embodiment is different from the second embodiment inthat the second layer L2 (insulation organic film 344) overlaps withedges of a pair of encapsulation inorganic films 350 a, 350 c.Additionally, an adhesive layer 354 is in contact with an insulationorganic film 344 but in no contact with a flattening organic film 332.What is explained in the first embodiment is applicable to other mattersin this embodiment.

Fourth Embodiment

FIG. 13 is a plan view of a display device in a fourth embodiment. FIG.14 is a XIV-XIV line cross-sectional view of the display device in FIG.13. FIG. 13 is a developed view before the display device is folded.

In the embodiment, the second layer L2 is situated in the edge area EAof a resin substrate 410 to avoid the display area DA. That is, thesecond layer L2 is an organic film provided to be different from alaminate structure in the display area DA. The second layer L2 can beformed by inkjet. The second layer L2 is adjacent to the edge area EAand on a circuit layer 434. The second layer L2 is on a flatteningorganic film 432 on the circuit layer 434, and on a pair ofencapsulation inorganic films 450 a, 450 c on the flattening organicfilm 432. Additionally, the second layer L2 is on an edge of the firstlayer L1 (reinforcement organic film 452). Neither the flatteningorganic film 432 nor the insulation organic film 444 is provided at aperipheral portion of the resin substrate 410 (left edge in FIG. 17).

FIG. 15 is a XV-XV line cross-sectional view of the display device inFIG. 13. FIG. 16 is a XVI-XVI line cross-sectional view of the displaydevice in FIG. 13. In FIG. 15, the second layer L2 does not extend tothe bending area BA of the resin substrate 410. By contrast, a softresin 458 extends in a direction from the bending area BA to the displayarea DA, slightly overlaps with the second layer L2, without overlappingwith the display area DA. The second layer L2 has an upper surfacesloping downward toward a tip overlapping with the soft resin 458. Thesecond layer L2 is on an edge of the circuit layer 434, in an area nextto a peripheral portion of the resin substrate 410 (FIG. 14) and in anarea next to the bending area BA (FIG. 15). By contrast, in FIG. 16, thesecond layer L2 is not formed in an area away from the peripheralportion of the resin substrate 410. The second layer L2 continuouslysurrounds the display area DA, on three sides (upper side, left andright sides in FIG. 13) in three directions which are perpendicular toadjacent each other, of four directions surrounding the display area DA,and the second layer L2 is discontinuous on the remaining one side(lower side in FIG. 13).

FIG. 17 is a XVII-XVII line cross-sectional view of the display devicein FIG. 13. The peripheral portion (left edge in FIG. 17) of the resinsubstrate 410 has an area where the second layer L2 is not provided. Thesecond layer L2 is disposed to avoid the bending area BA of the resinsubstrate 410. In the bending area BA, the flattening organic film 432is provided to avoid the peripheral portion of the resin substrate 410.What is explained in the first embodiment is applicable to other mattersin this embodiment. There is unevenness adjacent to the edge 434E of thecircuit layer 434 and between the resin substrate 410 and the circuitlayer 434, but the unevenness is eased due to satisfactory thicknesssecured in the second layer L2.

The display device is not limited to the organic electroluminescencedisplay device but may be a display device with a light-emitting elementsuch as a quantum-dot light emitting diode (QLED) disposed in eachpixel.

While there have been described what are at present considered to becertain embodiments, it will be understood that various modificationsmay be made thereto, and it is intended that the appended claims coverall such modifications as fall within the true spirit and scope of theinvention.

What is claimed is:
 1. A display device comprising: a resin substrate;multiple layers laminated on the resin substrate, the multiple layersincluding a display element layer for displaying images, the multiplelayers including a sealing layer for covering the display element layer;and a polarization plate attached to a first layer and a second layer ofthe multiple layers with an adhesive layer, wherein, the multiple layersinclude some inorganic films and some organic films, all of theinorganic films are disposed to avoid an edge area that is at least apart of a peripheral portion of the resin substrate, the polarizationplate has an edge above the edge area of the resin substrate, the firstlayer is disposed to avoid the edge area of the resin substrate, thefirst layer at an edge having an upper surface sloping downward towardthe edge area, and the second layer has a portion in the edge area ofthe resin substrate and between the resin substrate and the adhesivelayer.
 2. The display device according to claim 1, wherein the secondlayer overlaps with the edge of the first layer.
 3. The display deviceaccording to claim 1, wherein the inorganic films include a circuitlayer for constituting a circuit, and the circuit layer includes abarrier inorganic film laminated on and in contact with the resinsubstrate.
 4. The display device according to claim 3, wherein thebarrier inorganic film has an edge next to the edge area, and the secondlayer overlaps with the edge of the barrier inorganic film.
 5. Thedisplay device according to claim 3, wherein the organic films include aflattening organic film laminated on the circuit layer anddiscontinuously extending to the edge area, and the flattening organicfilm is the second layer.
 6. The display device according to claim 1,wherein the display element layer includes a plurality of pixelelectrodes, a counter electrode, and an organic electroluminescencelayer between a central portion of each of the plurality of pixelelectrodes and the counter electrode, the organic films include aninsulation organic film between an edge of each of the plurality ofpixel electrodes and the counter electrode, the insulation organic filmdiscontinuously extending to the edge area, and the insulation organicfilm is the second layer.
 7. The display device according to claim 6,wherein the organic films include an organic film in the edge area andunder the insulation organic film.
 8. The display device according toclaim 1, wherein the sealing layer includes an encapsulation organicfilm that is one of the organic films, the sealing layer including apair of encapsulation inorganic films that are a pair of the inorganicfilms and sandwiching the encapsulation organic film from above andbelow, the pair of encapsulation inorganic films are in contact witheach other around the encapsulation organic film, and the first layerand the pair of encapsulation inorganic films are aligned at tips. 9.The display device according to claim 8, wherein the second layeroverlaps with edges of the pair of encapsulation inorganic films. 10.The display device according to claim 1, wherein the peripheral portionof the resin substrate includes an area without the second layer. 11.The display device according to claim 1, wherein the second layer andthe edge area of the resin substrate are aligned at outer edges.